PART |
Description |
Maker |
SD12-XXX |
(SD Series) High Power Density / Low Profile / Shielded Inductors
|
Cooper Electronic Technologies
|
D38999-20WC98PN 8599-07482A-900 8599-0725-900 8599 |
High density (#22D) MI L-spec circular (1980’s) 8D Series - MIL-DTL-38999 Series III
|
List of Unclassifed Manufacturers List of Unclassifed Man...
|
634-015-563-010 634-015-563-020 634-015-563-130 63 |
634 SERIES HIGH DENSITY SUBMINIATURE D CONNECTOR
|
List of Unclassifed Man...
|
SLA416T SLA4162 SLA402T SLA4028 SLA4078 SLA407T SL |
(SLA40000 Series) High Density Gate Array
|
Epson
|
637-015-230-042 637-015-230-043 637-015-230-046 63 |
637 SERIES HIGH DENSITY SUBMINIATURE D CONNECTOR
|
List of Unclassifed Manufacturers
|
IDT72V273L6PF IDT72V243 IDT72V223 IDT72V253 IDT72V |
3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO 2K X 18 OTHER FIFO, 6.5 ns, PQFP80 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO 4K X 18 OTHER FIFO, 10 ns, PQFP80 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO 3.3伏高密度SUPERSYNC窄总线先进先出 RECEPTACLE, EMI, BACKSHELL, 360DEG; Gender:Receptacle; Ways, No. of:1; Series:RJF TV RoHS Compliant: No PLUG ASSEMBLY, 360DEG, EMI, BACKSHELL; Gender:Plug; Ways, No. of:1; Series:RJF TV RoHS Compliant: No
|
Integrated Device Technology, Inc. Integrated Device Technolog... Integrated Device Techn...
|
ATL35 |
The ATL35 series ASIC family is fabricated on a 0.35 micron CMOS process with up to four levels of metal. This family features arrays with up to 2.7 million routable gates and 976 pins. The high density and high pin count capabilities of t
|
Atmel
|
L60060C-AC L60030C L60030C-1C L60030C-1PQ L60030C- |
CAP 0.01UF 50V 10% X7R SMD-0805 TR-7-PA SN100 Class CC/CD and Midget Fuse Blocks CC CD和侏儒保险丝 RTS Series - Econoline Unregulated DC-DC Converters; Input Voltage (Vdc): 24V; Output Voltage (Vdc): 15V; Power: 2W; Assembly; High Power Density; Optional Continuous Short Circuit Protected; Efficiency to 85% CC CD和侏儒保险丝
|
LITTELFUSE[Littelfuse] Littelfuse, Inc.
|
DR127-2R2-R DR125-330-R DR125-560-R DR74-100-R DR7 |
High Power Density, High Efficiency, Shielded Inductors
|
Cooper Bussmann, Inc.
|
SD20-XXX |
High Power Density
|
Cooper Electronic
|
AM7200-35RC AM7200-35JC AM7200-35PC AM7200-50JC AM |
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 25 ns, PDIP28 HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 50 ns, PDIP28 Circular Connector; No. of Contacts:13; Series:MS27508; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:10; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No JT 13C 13#22D PIN WALL RECP
|
ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
|